爆料称 AMD 为微软 XBOX Helix 和索尼 PS6 主机设计的芯片已流片，前者浮点算力纸面领先四成

AI 导读

AMD为XBOX Helix和PS6主机设计的芯片已流片，XBOX浮点算力纸面领先40%，两款主机预计2024年底发售。

AMD's chips for XBOX Helix and PS6 are taped out with 40% higher FP32 performance for Helix, set for 2024 release.

重点速览

• AMD为XBOX Helix和PS6芯片完成流片，预计2024年底发售 AMD's chips for XBOX Helix and PS6 are taped out with 2024 release planned
• XBOX Helix浮点算力56TFLOPS领先PS6的40TFLOPS 40% XBOX Helix's 56TFLOPS FP32 leads PS6's 40TFLOPS by 40%
• 采用台积电N3P制程，XBOX芯片面积大42%内存多20% XBOX uses N3P process with 42% larger chip and 20% more memory
• 物料成本达960美元，零售价或超1000美元 Material costs reach $960 with retail price possibly over $1000
• 集成独立NPU和神经阵列，强化AI算力 Integrated NPU and neural array for enhanced AI

一句话：XBOX Helix通过算力优势巩固次世代主机竞争力。 / XBOX Helix strengthens its next-gen console competitiveness through performance edge.

推荐理由 揭示下一代主机技术趋势，影响行业竞争格局。